Reballing Stencil For iPhone 13 Series Mijing T3D A15 3D NAND BGA IC Chip
QUALITY - This reballing stencil is made from the finest materials to ensure its up to the job. Ultra-thin 0.12mm design with better application of solder paste tinning, continuous bending, and very tough.Â
USAGE - Needed to reball the IC Chips of the iPhone 13, 13 Pro, 13 Pro Max and 13 mini.
COMPATIBILITY - For use with iPhone 13 iPhone 13 Pro, iPhone 13 Pro Max, iPhone 13 Mini Only. Round square precise hole position, making steel mesh more durable, more off-grid, more efficient.
REQUIRED TOOL - This is a required tool for reballing ic's.
SMALL AND STRONG - This product is small and strong.
Original: $2,948.15
-70%$2,948.15
$884.45Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
QUALITY - This reballing stencil is made from the finest materials to ensure its up to the job. Ultra-thin 0.12mm design with better application of solder paste tinning, continuous bending, and very tough.Â
USAGE - Needed to reball the IC Chips of the iPhone 13, 13 Pro, 13 Pro Max and 13 mini.
COMPATIBILITY - For use with iPhone 13 iPhone 13 Pro, iPhone 13 Pro Max, iPhone 13 Mini Only. Round square precise hole position, making steel mesh more durable, more off-grid, more efficient.
REQUIRED TOOL - This is a required tool for reballing ic's.
SMALL AND STRONG - This product is small and strong.
