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Reballing Stencil For iPhone 7 7 Plus A10 CPU Mijing BGA IPH 3
MIJING BGA Stencil is a High Precision BGA Reballing Template for iPhone 7, 7 Plus & A10 CPU and can be used with direct heat. This is a required tool for reballing ic's on iPhone 7, 7 Plus & A10 CPU logic boards.
$442.22
Original: $1,474.07
-70%Reballing Stencil For iPhone 7 7 Plus A10 CPU Mijing BGA IPH 3—
$1,474.07
$442.22Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
MIJING BGA Stencil is a High Precision BGA Reballing Template for iPhone 7, 7 Plus & A10 CPU and can be used with direct heat. This is a required tool for reballing ic's on iPhone 7, 7 Plus & A10 CPU logic boards.
