
Reballing Stencil For iPhone XS XS Max Mijing BGA IPH12 1
MIJING BGA Stencil is a High Precision BGA Reballing Template for iPhone XS, XS Max and can be used with direct heat. This is a required tool for reballing ic's on iPhone XS, XS Max logic boards.
Original: $1,474.07
-70%$1,474.07
$442.22Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
MIJING BGA Stencil is a High Precision BGA Reballing Template for iPhone XS, XS Max and can be used with direct heat. This is a required tool for reballing ic's on iPhone XS, XS Max logic boards.

















