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Reballing Stencil For MSM 8992A 8976A 8996A Qualcom CPU Mijing BGA qu1
MIJING BGA Stencil is a High Precision BGA Reballing Template for MSM 8992A/8976A/8996A, Qualcom CPU and can be used with direct heat. This is a required tool for reballing ic's onMSM 8992A/8976A/8996A, Qualcom CPU.
$1,474.07
Reballing Stencil For MSM 8992A 8976A 8996A Qualcom CPU Mijing BGA qu1—
$1,474.07
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
MIJING BGA Stencil is a High Precision BGA Reballing Template for MSM 8992A/8976A/8996A, Qualcom CPU and can be used with direct heat. This is a required tool for reballing ic's onMSM 8992A/8976A/8996A, Qualcom CPU.
