BGA solder paste is a specialized material crucial for the surface mount assembly of complex electronic components like microprocessors and memory chips. 

 

Features:
Ideal for EMMC chip replacements.
Suitable for reworking and repairing various circuit boards.
Provides high joint intensity for durable connections.
Features excellent immersion properties for smooth application.
Offers good insulating capabilities to safeguard electronic components.
Designed for use with cell phone PCBs and surface-mounted devices (SMD) such as BGA and PGA.
Aids in circuit board repairs and protects sensitive electronic components.
An essential material for mobile phone mainboard repairs.
Available in a convenient 35g size.

 

Package Content:
1 x BGA Solder Paste